APA (7th ed.) Citation

Technická univerzita v Košiciach. International Spring Seminar on Electronics Technology, Pietriková, A., Wohlrabe, H., Nicolics, J., & Unger, M. (2020). 43rd International Spring Seminar on Electronics Technology: Trend in microelectronics packaging and interconnection technology (Edition: first.). Technická univerzita v Košiciach.

Chicago Style (17th ed.) Citation

Technická univerzita v Košiciach. International Spring Seminar on Electronics Technology, Alena Pietriková, Heinz Wohlrabe, Johann Nicolics, and Michael Unger. 43rd International Spring Seminar on Electronics Technology: Trend in Microelectronics Packaging and Interconnection Technology. Edition: first. Košice: Technická univerzita v Košiciach, 2020.

MLA (9th ed.) Citation

Technická univerzita v Košiciach. International Spring Seminar on Electronics Technology, et al. 43rd International Spring Seminar on Electronics Technology: Trend in Microelectronics Packaging and Interconnection Technology. Edition: first. Technická univerzita v Košiciach, 2020.