43rd International Spring Seminar on Electronics Technology trend in microelectronics packaging and interconnection technology
| Corporate Author: | |
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| Other Authors: | , , , |
| Format: | Software eBook |
| Language: | English |
| PhysicalDescription: | 1 CD-ROM farebný 12 cm |
| Published: |
Košice
Technická univerzita v Košiciach
2020
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| ISBN: | 9788055335292 |
| Edition: | Edition: first |
| Subjects: |
| Item Description: | Obsahuje biografické údaje |
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| Physical Description: | 1 CD-ROM farebný 12 cm |
| ISBN: | 9788055335292 |
| Bibliography: | Obsahuje bibliografiu a menný register |


