APA (7th ed.) Citation

Géczy, A., Hajdu, I., Léner, V., & Zsolt, I. Low Temperature Soldering on Biopolymer (PLA) Printed Wiring Board Substrate.

Chicago Style (17th ed.) Citation

Géczy, Attila, István Hajdu, Vilmos Léner, and Illyefalvi-Vitéz Zsolt. Low Temperature Soldering on Biopolymer (PLA) Printed Wiring Board Substrate.

MLA (9th ed.) Citation

Géczy, Attila, et al. Low Temperature Soldering on Biopolymer (PLA) Printed Wiring Board Substrate.