Harcuba, P., Janeček, M., & Slámová, M. The effect of Cu and Ni on the structure and properties of the IMC formed by the reaction of liquid Sn-Cu based solders with Cu substrate.
Chicago Style (17th ed.) CitationHarcuba, P., M. Janeček, and M. Slámová. The Effect of Cu and Ni on the Structure and Properties of the IMC Formed by the Reaction of Liquid Sn-Cu Based Solders with Cu Substrate.
MLA (9th ed.) CitationHarcuba, P., et al. The Effect of Cu and Ni on the Structure and Properties of the IMC Formed by the Reaction of Liquid Sn-Cu Based Solders with Cu Substrate.
Warning: These citations may not always be 100% accurate.
