APA (7th ed.) Citation

Hotový, I., Liday, J., Marton, M., Kotlár, M., Vogrinčič, P., Vretenár, V., & Řeháček, V. (2013). IMPROVING THE OHMIC PROPERTIES OF Au/Ni-Mg/p-GaN CONTACTS BY ADDING SWCNT METALLIZATION INTERLAYER BETWEEN METAL AND p-GaN LAYERS.

Chicago Style (17th ed.) Citation

Hotový, Ivan, Jozef Liday, Marián Marton, Mário Kotlár, Peter Vogrinčič, Viliam Vretenár, and Vlastimil Řeháček. IMPROVING THE OHMIC PROPERTIES OF Au/Ni-Mg/p-GaN CONTACTS BY ADDING SWCNT METALLIZATION INTERLAYER BETWEEN METAL AND P-GaN LAYERS. 2013.

MLA (9th ed.) Citation

Hotový, Ivan, et al. IMPROVING THE OHMIC PROPERTIES OF Au/Ni-Mg/p-GaN CONTACTS BY ADDING SWCNT METALLIZATION INTERLAYER BETWEEN METAL AND P-GaN LAYERS. 2013.