Skip to content
Book Bag:
0
items
(Full)
Login
Language
English
Slovak
Catalog
Catalog Books
Articles
Catalog ONDV
Catalog OND
All Fields
Title
Author
Subject
Call Number
ISBN/ISSN
Find
Advanced
Design of heat dissipation fro...
Cite this
Print
Export Record
Export to MARC
Export to BibTeX
Export to Jednoduchý textový výpis
Export to ISBD (text)
Export to Citácia ISO 690 (HTML)
Export to Citácia ISO 690 (.doc)
Add to Book Bag
Remove from Book Bag
Permanent link
Design of heat dissipation from 3D LTCC STRUCTURES BASED ON HETEROSTRUCTURE
Bibliographic Details
Main Authors:
Jurčišin, M.
(Author)
,
Kardoš, S.
(Author)
,
Slosarčík, S.
(Author)
Format:
Article
Language:
English
Pozri predplatné
Predplatné
Kliknite na „Pozri predplatné“.
Holdings
Description
Similar Items
Staff View
Similar Items
The Design Concept of System Integration Based on Heterostructure
by: Cabúk, Pavol, et al.
LTCC BASED TECHNOLOGY FOR 3D FORMED MODULES
by: Pietriková, Alena, 1956-, et al.
LTCC based technology for 3D formed modules
by: Slosarčík, Stanislav, 1957-, et al.
On the Application of 3D LTCC and Flexible Structures Based on Galvanized Layers
by: Šandera, Josef, et al.
THE LTCC POTENTIAL IN THE 3D FORMED MODULES
by: Vehec, Igor, et al.