Influence of indium and copper in Sn3.5Ag0.4CuIn solder on its interaction with copper

Bibliographic Details
Main Authors:	Šebo, Pavol, 1939- (Author), Švec, Peter, 1955- (Author), Janičkovič, Dušan (Author), Illeková, Emília, 1949- (Author)
Format:	Article
Language:	Slovak English
Subjects:	bezolovnaté spájkovanie spájky Cu indium

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