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|a urn:nbn:sk:snk-abc70c
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|a (urnnbn)urn:nbn:sk:snk:ar-001l66
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|b eng
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|c SK
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| 080 |
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|a 621.791.35
|2 1997
|
| 245 |
0 |
0 |
|a Influence of indium and copper in Sn3.5Ag0.4CuIn solder on its interaction with copper
|c P. Šebo ... [et al.]
|
| 300 |
|
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|b Obr., tab.
|
| 504 |
|
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|a Bibliogr. odkazy
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| 504 |
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|a Res. angl.
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0 |
7 |
|a bezolovnaté spájkovanie
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| 650 |
0 |
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|a spájky Cu
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|9 1583946
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| 650 |
0 |
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|a indium
|2 snkbucl
|9 51297
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| 700 |
1 |
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|a Šebo, Pavol,
|d 1939-
|4 aut
|9 114544
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| 700 |
1 |
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|a Švec, Peter,
|d 1955-
|4 aut
|9 125453
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| 700 |
1 |
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|a Janičkovič, Dušan
|4 aut
|9 565058
|
| 700 |
1 |
|
|a Illeková, Emília,
|d 1949-
|4 aut
|9 39825
|
| 773 |
0 |
|
|t Kovové materiály
|g Roč. 47, č. 4 (2009), s. 275-282
|x 0023-432X
|
| 850 |
|
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|a Slovenská národná knižnica
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| 852 |
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|a Slovenská národná knižnica
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| 958 |
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|a article15
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| 958 |
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| 958 |
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|a EUIPO
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| 999 |
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|c 3239552
|d 3241482
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